Used LOGITECH PM5 #9080752 for sale

ID: 9080752
Vintage: 1999
Lapper / Polisher Includes: 5" Jig, P/N: 1PP54 Vacuum mounting system Vacuum port Up to 3" wafers Dial meter Abrasive auto-feed cylinder, P/N: 1CYL1 12" Plate (not for III-V, ok for Si) P/N: 1PM58 P/N: 1CYL11 P/N: 1PP54 1999 vintage.
LOGITECH PM5 is an advanced wafer grinding, lapping and polishing equipment that has been designed specifically for microelectronic production. It is the most advanced tool of its kind and is used to create exceptionally consistent and high quality surfaces. LOGITECH PM 5 is equipped with an advanced grind, lapping and polishing head technology, which precisely grinds and polishes the wafers to a specified standard. The diamond abrasive discs are used to grind the wafers, and the polishing pads and diamond films can be used to polish the surfaces, creating the exact shape desired. The system is also equipped with a range of advanced sensors that monitor the grinding pressure, speed, and temperature, as well as the polishing accuracy, ensuring that the surface of the wafer meets the desired specifications. PM5 is capable of processing wafers ranging from small chips to large substrates, with maximum diameter of up to 200 mm. The wafers are held in place by a reliable vacuum chuck, ensuring accurate grinding and polishing throughout the production process. PM 5 is also equipped with a number of advanced features that make the production process more efficient. The automated sample loader reduces time wastage during grinding sequence changes, and the loading cycles can be set up for up to 10 wafers per batch. It also includes a precision sensor monitor for stability and accuracy, and advanced simulation tools for accurate wafer grinding and machining. In addition, LOGITECH PM5 includes a variety of safety features, such as an emergency brake that stops the machine in case of any danger. The unit is also equipped with a robust interlock machine to ensure safety at all times. Overall, LOGITECH PM 5 is an advanced and efficient tool that provides precise and precise grinding, lapping and polishing of wafers, allowing production of high quality and consistent surfaces. Its advanced features, safety features and user friendly interface make it a great choice for any microelectronics production facility.
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