Used LOGITECH PM5 #9206610 for sale

LOGITECH PM5 is an automated, all-in-one wafer grinding, lapping and polishing equipment. This innovative system has been designed to provide fast cycle times for wafer grinding and polishing of the same quality as manual systems, and offers the precise, programmable, and repeatable processes needed for research and product development. By incorporating a precision tool spindle, dynamic tensioning unit, and adjustable angular traverse, LOGITECH PM 5 provides exceptional capacity for grinding, lapping, and polishing wafers up to 8 inches in diameter. This features helps to reduce cost per wafer for actual production process. With a unique combination of cyclometer driven and precision motion controls, the machine can reach speeds of up to 5,000 rpm and is capable of producing levels of accuracy and repeatability that surpass those achieved by manual systems. PM5 also features an integrated measuring station, allowing for Process Control Verification (PCV) to be completed on-site. This is accomplished with a high-resolution digital camera, enabling the capture of images for wafer topography measurements before and after processes, as well as real-time analysis of the Grind and Lap distortions. This feature provides powerful feedback for process parameter and product optimization. PM 5 is capable of processing a vast range of material sizes and types and is also capable of polishing multiple types of materials with a wide variety of slurry combinations. Additionally, the machine is able to accommodate a range of abrasives including polycrystalline diamond (PCD), diamond, and cBN. The tool is also equipped with a customized user interface that allows for complete control in the machine setup and operation. Owing to its robust construction, precise operation, and innovative features, LOGITECH PM5 has been an ideal choice for wafer production needs including metrology, and research and development processes. The automated wafer grinding, lapping and polishing asset provides fast and precise wafer processing with repeatable accuracy, while maintaining the highest level quality of the wafers.