Used LOGITECH PM5 #9248437 for sale

LOGITECH PM5 is a wafer grinding, lapping and polishing equipment designed to produce high quality, flat IC wafers for semiconductor manufacturing and microelectronics industries. The system utilizes an orbital spindle with a variable speed control and a vacuum chuck to securely hold and precisely control the movement of the wafer during processing. The unit is equipped with high power options for grinding, lapping and polishing at different speeds and pressures to produce the desired results. The machine also features a onboard vacuum tool to collect particles that are generated in the process, as well as a cooling asset to keep the wafer and processing chamber temperatures at an optimal level. In addition, the model includes a D: R software package to control the variable speed, cutting force and vacuum levels needed in the process. LOGITECH PM 5 is capable of performing various wafer processes, such as shaping, grinding and lapping, by using abrasive slurries in combination with polishing pads. These processes help minimize wafer defects, improve the surface quality, and achieve a highly desirable flatness that is necessary to produce high quality chips. The equipment is also capable of both single- and double-pass lapping, allowing for a broader range of specifications for a flat wafer surface. The system features an intuitive and user-friendly touchscreen interface that allows operators to quickly and easily program the desired lapping, grinding, and polishing procedures. It also includes an auto-clamping unit for secure wafer loading and unloading and a grit calculation machine to calculate and optimize the cutting parameters for the best results. Once programmed, the tool can run in semi-automated or full-automated controls for high throughput. Overall, PM5 is a versatile and highly efficient wafer grinding, lapping and polishing asset that can process semiconductor wafers with superior accuracy and speed. With the various cutting, grinding and polishing options available, the model is capable of achieving quality IC wafers with precision flatness for a wide range of applications.