Used LOGITECH PM5 #9386415 for sale

LOGITECH PM5 is a wafer grinding, lapping and polishing equipment suitable for a wide variety of applications requiring finely finished wafers. The system offers automated wafer handling, lapping and polishing of wafers up to 8" in size with an accuracy of ±2 to 4μm flatness. This advanced unit is designed to achieve high levels of throughput and productivity, while minimizing the risk of edge damage or discoloration. The lapping process is based on an innovative sub-micron abrasive film that engraves a profiled surface finish, enabling wafers to be processed from very rough to highly polished conditions. The lapping plate also allows for fine matt and gloss finishing of the wafer. The lapping and polishing plate has a built-in high frequency drive that vibrates the plate at approximately 180Hz, ensuring high quality planarization of the wafer. On LOGITECH PM 5, the wafers are loaded into an automation tray that is fed into the machine for processing. The wafers are then transferred sequentially into the lapping and polishing apparatus where polishing is done to a precision of ±2 to 4μm flatness. The wafers can be further processed through either the matt or gloss finish based on preference. Along with the automated handling of wafers, the tool also includes the capability to measure the flatness and warp of the wafer using an interferometer, allowing for better control of the precision. PM5 is fitted with safety features on the lapping and polishing plate which prevents any operation of the machine when cover is opened. This ensures maximum safety of the operator and any nearby personnel. The asset is also equipped with user interface software that allows for advanced monitoring and control of the lapping and polishing process. The model is easy to install, operate and maintain, making it the perfect choice for any production environment.