Used LOGITECH PM5 #9396066 for sale

LOGITECH PM5 is a wafer grinding, lapping and polishing equipment designed for precision semiconductor wafer preparation. It is capable of automated surface preparation of small wafers with extreme accuracy. LOGITECH PM 5 utilizes advanced technologies such as diamond grinding and polishing techniques to provide superior wafer results. The system consists of two main components - the abrasive wheel head unit and the polishing head. The abrasive wheel head utilizes diamond grinding techniques to accurately contour the wafer surface. The abrasive wheel head is designed with a high precision leveling unit, and repeatable programmable parameters including pressure, speed, and depth of cut. This machine can efficiently support various wafer sizes and other shapes. The abrasive wheels used by the abrasive wheel head utilizes the exclusive "last-step" waste reduction method for fine-structure grinding and polishing. In addition, PM5 is outfitted with a polishing head which utilizes diamond lapping techniques to improve the wafer surface finish. The polishing head is designed to utilize a "one-shot" polishing process, in which diamond particles are pulled away from the surface of the wafer and left behind for additional polishing before the wheel is removed. This polishing head is also equipped with a dual layer destruction tool that uses three stages of destruction to provide precise surface profile finishing. PM 5 is equipped with a sophisticated software control tool, designed specifically for wafer grinding applications. The software provides an easy-to-use interface for setting and adjusting grinding parameters, as well as providing a platform for monitoring process effectiveness. LOGITECH PM5 is designed for efficient wafer processing, and is capable of producing wafers of up to 5mm thick. It is also designed with safety features that include emergency shutoff, temperature control, and low pressure limits. LOGITECH PM 5 is suitable for use in a variety of wafer processing applications, including flip chip fabrication, 3D IC packaging, and micro-electronics. Its compact size and superior performance make it the ideal choice for a variety of wafer grinding, lapping, and polishing processes.