Used LOGITECH PP5D #9121200 for sale

LOGITECH PP5D Wafer Grinding, Lapping and Polishing Equipment is designed for precision planarization and material removal processes. It is ideal for back-grinding and lapping of compound semiconductor materials, such as gallium nitride (GaN) or silicon carbides (SiC) to depths of microns with high precision. The system utilizes a high-precision linear motor driven Z-axis to ensure that the grinding surface remains within 0.02um of planar of the playing sample, which is critical for maintaining sample integrity. The user interface provides a simple menu based control and can accommodate up to ten grinding programs. The unit's advanced grinding heads are designed to provide stable grinding forces and precise profiles forming, resulting in perfect planar surfaces with minimal burrs and polished finishes. Tools are available for various grinding operations such as line grinding, threshold grinding and cross-section grinding. Advanced grinding heads have working diameters up to 3" and feature variable speed and adjustable pressure settings. The machine is also equipped with an automated cleaning tool that eliminates the need for manual cleaning of the grinding tool and sample. This cleaning process uses a hydrochloric acid solution to remove particles and residues created during the grinding process. PP5D also has an integrated lapping unit to ensure that the planarized surface is perfectly smooth and flat. A lapping compound is used to polish the finished samples through a series of auto-controlled steps that occur when the wafer is placed in the lapping unit. LOGITECH PP5D is an extremely versatile asset that can grind, lap and polish a wide variety of materials for use in the semiconductor, optoelectronic and medical device industries. It is capable of achieving high precision, accurate planarization of surfaces with minimal materials removal.