Used LOH 1020C #9174754 for sale

LOH 1020C is an advanced wafer grinding, lapping and polishing system designed for precision surface processing of semiconductor materials. This highly automated machine offers a high degree of accuracy and repeatability, enabling an efficient and cost-effective production. 1020C features two large grinding wheels mounted side-by-side on a horizontal plane. The grinding wheels are specific designed to efficiently and accurately shape semiconductor wafers. They are fabricated from a special bond composition in order to ensure minimal chip generation and maximum accuracy. The grinding wheels can be used to produce various types of wafer shapes, including flat, spherical and other custom profiles. LOH 1020C also features a secondary lapping head, which is able to quickly finish the surface of the wafer to a high degree of accuracy. This is done by pressing the wafer against the rotating lapping head, which utilizes a special type of abrasive to finely finish the wafer surface. The lapping head also features a special porous disk to evacuate particles generated during the grinding and lapping processes, ensuring a dust-free operation. In addition to grinding and lapping, 1020C features a polishing head, which can be used to polish wafers to a highly reflective finish. This is achieved by compressing the wafer onto a rotating polishing head, which utilizes a chemically-treated cloth pads and/or discs to apply a uniform, scratch-free finish to the wafer. LOH 1020C is also equipped with many other features such as a computer-controlled touch-screen interface, which allows the user to efficiently adjust the grinding/lapping/polishing parameters and to monitor the progress of the process. Manual operation of the system is also possible, using the control buttons on the front panel. Overall, 1020C is an excellent choice for grinding, lapping and polishing semiconductor materials. Its precision, speed and versatility can be used to produce wafers of high quality and accuracy, and its highly automated features make it a cost-effective solution for semiconductor production.