Used LOH FM4 #9127661 for sale

LOH FM4 is a wafer grinding, lapping and polishing equipment that enables surface preparation for semiconductor and silicon wafers before the wafers can be used in electrical applications. The system utilizes a specialized support structure to secure the substrates during the grinding and lapping processes. The surface preparation is achieved by using known surface preparation techniques such as spin grinding, large area lapping, planar grinding, and polishing. The unit consists of two parts: a precision control unit (PCU) and a linear lapping machine (LLM). The PCU is a servo controlled device that controls the movement of the wafer for precise grinding and lapping operations. It features high accuracy and repeatability, allowing users to adjust the speed, direction, and acceleration of the grind and lapping operations. The LLM is a linear motor powered by an attractive force on an inductor. It produces a constant controlled force so that the final surface shape has maximum accuracy. FM4 uses a water-cooled diamond grinding wheel to create a consistent finish on the wafer. The wheel is made from a high-purity resin that contains multiple layers of polycrystalline diamond particles. The polycrystalline structure is designed to reduce fragmentation and maximize grinding efficiency. The grinding wheel is attached to the PCU and runs at a variable speed that can be adjusted by the user. The LLM can then be used to lap the wafer for a uniform finish. The machine is also equipped with a polishing pad which is used to polish the wafer. This process removes roughness from the surface of the wafer and increases its reflectivity and surface flatness. The polishing pad is made from a porous, durable material and is designed to provide superior results with minimal abrasive material consumption. LOH FM4 is designed to meet the high-precision needs of semiconductor production. The tool can be customized to meet the needs of various industries and provides a reliable and efficient method of wafer surface preparation. It offers users a cost effective way of polishing and lapping wafers before they can be used in electronic products.