Used LOH LP 100 #77403 for sale

ID: 77403
Two spindle polisher, 190mm capability, +/- 30-100mm radius, air pressure.
LOH LP 100 is a cutting edge wafer grinding, lapping and polishing equipment designed with the highest precision and accuracy. It offers a high-grade solution for industrial wafer treatment by enabling optimal surface finish and on-site fabrication at large scale production shops and R&D oriented labs. The system consists of the grinding and lapping chamber, the polishing chamber, and the grindstone, lapping discs and polishing pads. The grinding chamber is equipped with 9 diamond grinding wheels, and a programmable controller which allows for superior control over the grinding process. It utilizes an in-situ surface detection unit to detect the grinding surface and adjust the parameters accordingly to achieve an optimum surface finish. The lapping chamber features two separate stepper motors that spin the lapping discs. The programmable controller and in-situ surface detection machine help achieve uniformity in the lapping process and perfect surface finish. The polishing chamber is designed to provide top-notch polishing within a short span of time. It features eight individually controlled polishing pads, together with an adjustable pressure head. The tool is integrated with servo precision motors and controlled by an intuitive programmable control asset. The pressure head and individual pads are controlled through the controller, and can be adjusted as per the requirement. For maximum durability and accuracy, the model is composed of high precision metal and plastic components. There is a double chamber equipment for water and lubricant to ensure that the wafer does not become contaminated during the process. It also includes a tungsten carbide blade which ensures that the edges of the wafer are smooth. The system is also equipped with a dust extraction unit which enables efficient extraction of the grinding and lapping particles. LP 100 wafer grinding, lapping and polishing unit is ideal for large scale industrial wafer treatment, providing superior accuracy and surface finish within a short span of time. Its user friendly and precise programmable control machine is ideal for achieving excellent surface finishes with minimum effort. Its design is precise and robust, making it a perfect choice for industrial operations.
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