Used LOH MT-2 #52738 for sale

LOH MT-2 is a high-precision wafer grinding, lapping and polishing equipment designed to bring convenience, accuracy and flexibility to wafer processing. The system features a powerful grinding and polishing head, offering a broad range of aggressive grinding and polishing speeds, as well as a unique heat sink mechanism which prevents clogging, allows for highly efficient machining, and channels away over-heated particles. MT-2's grinding head operates in a range of 0.1-10 mm/s, offering a wide variety of grinding modes and speeds. The grinding head is capable of processing wafers in both directions, offering uniform, consistent grinding results. Additionally, the grinding head allows for gentle grinding and polishing which minimizes edge chipping and scratches on the wafer surfaces. The wafer lapping process delivered by LOH MT-2 is also highly efficient, featuring adjustable speeds from 0.1-10 mm/s and a special polishing plate design which ensures uniform polishing on both sides of the wafer. The lapping and polishing head allows for fine-tune adjustments of the tool-plate geometry to compensate for the tilting of wafers. In terms of safety, MT-2 features an Advanced Process Control Unit which monitors and protects the machine from overloading. Additionally, a comprehensive fire prevention tool with flammable gas sensors and quenching systems ensures secure operation. The asset also offers multiple safety options such as real-time process monitoring, dust collection and filtering, material tracking and traceability, and secure storage of processed samples. Overall, LOH MT-2 is a powerful and versatile model offering ideal grinding, lapping, and polishing capabilities for a wide range of wafer processes. Its range of adjustable speeds, heat sink design and comprehensive safety features make it an ideal tool for production lines.