Used LOH PM 150 #77402 for sale

LOH PM 150 is a state-of-the-art wafer grinding, lapping and polishing equipment designed to deliver maximum productivity, throughput and the highest level of part quality available in the industry. With the highest accuracy control of wafer size and thickness, it is optimized for optimal surface finish. PM 150 can easily handle a variety of wafer sizes, shapes, polishing and grinding requirements - including those with nanometer scale features. It offers rapidly cycle times and is designed with operation safety in mind. The system features robust and durable construction that is ideal for ultra-precise lapping and polishing of various materials and substrates. The large plate loading capacity allows for high productivity for large-scale grinding, lapping and polishing operations. A unique two-stage grinding and polishing platform is included, providing efficient and high-precision material removal. The unit is capable of applying a wide range of grinding, lapping and polishing conditions, from diamond slurry to ionized particles. It also includes a full range of abrasives, such as diamond micro-grains, aluminum oxide, silicon carbide, and more. The variable speed controllers enable the user to match the process speed to the material type allowing for unmatched control and repeatable results. LOH PM 150 features a user-friendly touchscreen graphical user interface (GUI) that allows for expedited process setup and optimization. Its intuitive editing tools make it easy to create, store and access process recipes. Furthermore, multiple data channels and the profiling capabilities produce a profile of material removal and film formation fit for precision requirements. The machine's integrated, progressive grinding unit is designed to automatically guide the user in setting process parameters, such as uniform speed, work pressure, and slicing force. The integrated motor head design offers flexibly positionable, low-vibration motor mounting which facilitates faster changing of the motor and reduces service time. PM 150 is the ideal tool for production lapping and polishing, thanks to its highly reliable, efficient and repeatable results, rigorous safety, streamlined process design, intuitive GUI and precision controls. With production output of up to 150 wafers per hour, this asset is the perfect choice for organizations that need the highest accuracy and repeatability in their work.