Used LOH RF 3A #77401 for sale

LOH RF 3A is a state-of-the-art wafer grinding, lapping and polishing (WGPL) equipment. This highly versatile machining system integrates both grinding and polishing capabilities, allowing for multiple machining processes of wafers. RF 3A has a unique architecture which can accommodate 3-inch and 4-inch wafers, up to 8" in diameter. It is powered by a powerful robotic tool changer, which can handle a wide range of various grinding and polishing wheels. LOH RF 3A unit is designed with a high-precision scanner, motion control machine and robotic IO modules. The scanner accurately detects the positions of the wafers and performs in-process inspections. It comes with a built-in library of wafer recipes, allowing it to reliably machine different wafers with different settings. The motion control tool is designed to offer high speed and accuracy in positioning, grinding and polishing operation. The robotic IO modules provide precise and repeatable control over all machining parameters. RF 3A feature a built-in chiller to maintain the temperature within the machining areas. LOH RF 3A is engineered for high quality and repeatable performance. It can leave the wafers with a very flat and smooth surface finish. The machine is highly automated and is able to handle multiple wafers in one session. It is highly configurable, allowing for multiple machining operations and processes. The asset is run by a powerful computer-based process controller, providing a high degree of flexibility in the settings and parameters. Furthermore, RF 3A is designed with the most reliable safety features. It is built with safety interlocks and other safety features which ensure the safe and proper operation of the machine. The model is mechanical, electrical and RF compatible, making it suitable for various wafer applications. LOH RF 3A comes with easy and intuitive interface and setup, enabling the operator to quickly and efficiently set up the machine for different processes. Overall, RF 3A is a highly capable and reliable WGPL equipment, specifically designed for the machining of wafers. Its precision scanning and motion control systems, robotic tool changer and automated processes provide repeatable and high quality machining results. LOH RF 3A is highly configurable and can be used for multiple machining processes of various wafers.