Used LOH Toro-X-1000 #9047153 for sale

LOH Toro-X-1000 is a wafer grinding, lapping and polishing equipment manufactured by LOH Advanced Technic, ideal for post dicing on a wafer level in the semiconductor industry. The system features an electronic control stage and a grinding stage to easily process wafers from up to 3-inch (76.2mm) to 6-inch (152.4mm) in diameter. Toro-X-1000 is equipped with automatic grinding and lapping control unit, temperature control machine, bubble cleaning tool and pressure control asset. The structure of the model is composed of an electronic control stage, an air line equipment and a grinding stage. The electronic control stage comprises of a PC control unit, stepper motor controls, a water cooling system and a calibration circuit. The PC control unit is used for setup operations such as wafer diameter setting and wheel power setting, as well as providing control on grinding quality. The stepper motor controls are used to maintain a constant wheel speed during the grinding process. The water cooling unit is used to cool the grinding wheel and protect it from over-heating, while the calibration circuit ensures accuracy during the grinding process. The air line machine of LOH Toro-X-1000 tool pumps compressed air from a blower into the grinding stage to generate airflow to the grinding surface. This airflow helps to cool down the grinding surface and dissipate the heat generated during the process. The grinding stage contains grinding cup holders, grinding wheels and shields that protect the wafer from impact forces caused by the grinding process. The grinding wheels are typically diamond-plated and vary in size based on the wafer type. The grinding process of Toro-X-1000 asset consists of the main grinding action followed by the lapping and polishing stages. The main grinding action cuts through the thin layers of the wafer to form a starting point for the lapping and polishing. During the lapping stage, the machine consists of two wheels which move in opposite directions to lap the wafer's surface. During the polishing stage, a Rotating Polishing Pad with diamond particles polishes the wafer surface to add a uniform finish. In short, LOH Toro-X-1000 is a precision wafer grinding, lapping & polishing model designed to process up to 6-inch wafers. It features a comprehensive electronic control stage, grinding wheel and air line equipment, providing accurate control and protection during the grinding, lapping and polishing stages. The high-tech features of the system make it ideal for post-dicing in the semiconductor industry.