Used LOH Toro-X-2000 #170510 for sale

LOH Toro-X-2000 is a leading-edge wafer grinding, lapping, and polishing equipment. It is a high-precision, automated system that is specifically designed to produce ultra-fine and uniform surfaces on silicon wafer surfaces. It works by using a specialized CCD laser vision unit and a range of diamond tools to achieve high-precision results. The machine can accommodate wafer sizes ranging from 100mm to 200mm, and extends across a wide range of materials including (but not limited to) silicon, ceramic, and glass. Its automated operation and user-friendly interface provide great convenience. An embedded tool is employed to ensure accurate positioning and precise movement at every stage of the process. Additionally, its intuitive software enables efficient process management and traceability. Toro-X-2000 features a low-profile design and a sturdy frame that ensure durability and stable operation. Its optimized power and cooling asset support the long-term use of high-load and high-precision grinding, lapping, and polishing processes. The grinding head is composed of two precisely pivoted arms, each rotated by a brushless motor. Equipped with an 8-channel controller, the grinding head can auto-correct the position of the rotating diamond tool after each cycle. This ensures an even and precise finish. The model's advanced wet lubrication equipment helps to achieve exquisite finish and high precision. The integration of an advanced Jet System sprays a precise amount of lubricant to facilitate a smooth and lubricated grinding process, prolonging the lifespan of the diamond tool. During the polishing process, a compression intensity controller allows for precise adjustment of the diamond applicator tool. This provides the flexibility to optimize the tool and the wafer surface. LOH Toro-X-2000 also features in-situ particle checking and an auto-monitoring unit. These features enable immediate feedback and thereby provide for improved process control and maintenance. Additionally, its gas evacuation machine ensures an effective mitigation of fine particles. This tool is especially important as any dust-related contamination can adversely affect the overall quality of the end result. Toro-X-2000's robust performance and precise accuracy make it ideal for a wide range of high-precision wafer grinding, lapping, and polishing applications. Its automated operation and user-friendly interface provide great convenience. Its advanced features make LOH Toro-X-2000 an ideal choice for lasting, reliable performance.