Used LOH Toro-X-2000 #9047152 for sale

LOH Toro-X-2000 is an advanced wafer grinding, lapping & polishing system for achieving precise and accurate material removal. It can accommodate up to 4 grinders, 6 lapping plates, and 8 polishers, allowing it to provide superior performance for a variety of wafer sizes. Toro-X-2000 grinders are equipped with independent, variable speed spindles that can operate at high speeds with minimal vibration. Each grinder has a specialized diameter in accordance to the size of the wafers being processed. LOH Toro-X-2000 also produces a uniform surface finish while removing material quickly and reliably. The lapping plates used in Toro-X-2000 are designed for precise removal of material from the wafers. They are capable of controlling each substrate's motion and speed so that even the smallest details can be achieved. Their special design allows the plates to work independently, allowing for a uniform lapping process. The polishers used in LOH Toro-X-2000 are dual-aimed, providing the user with the ability to direct the force of the tool to the exact area of the wafer for an optimal finish. This advanced control also significantly reduces the risk of damaging the wafer by focusing the force precisely where it is needed. Finally, Toro-X-2000 meets the needs of customers with its universal wafer-loading system, which can accommodate a wide range of wafer sizes. This means that processes for different wafer sizes can be reproduced with a minimal amount of time and effort. The versatility and reliability of LOH Toro-X-2000 made it the preferred system of choice by many top-tier semiconductor manufacturers around the world. With its advanced grinding, lapping, and polishing capabilities, it is the perfect solution for achieving the highest levels of precision and accuracy when working with precision components.