Used LOH UFM #77411 for sale

LOH UFM Wafer Grinding, Lapping & Polishing Equipment is an automated, modular system for processing and polishing of compound semiconductor substrates and components. The unit offers a unique combination of automation and process flexibility. With a broad processing capability range, this automated process is suited for die attach polish and other wafer grinding, lapping, and polishing operations. UFM offers a powerful machine that is capable of processing flat, recessed, and steep wafers with both high accuracy and a high throughput. The UFMprovides precision automation that is process-settable, ergonomically designed, and includes full motion control and rigid body transport. The unique construction of this tool also acts as a buffer to noise, shock, and vibration. The integrated, automated control asset assures process accuracy and repeatability. The process-driven methodology of the model helps to reduce operator fatigue in even the most challenging production environments. The equipment is equipped with an independent computer control system, which enables easy programming and operation. The unit also includes an embedded process control software that can be programmed and configured with custom software if necessary. LOH UFM is also equipped with numerous safety features which provide critical safety control and protection. The integrated process control machine simultaneously monitors and controls processes in the various stages of the grinding, lapping and polishing process. UFM also offers an extensive range of custom vibration isolation options, which helps to ensure that the quality and accuracy of the processed components remains consistent. LOH UFM offers an innovative solution for grinding, lapping and polishing of high aspect ratio substrates and components. With its modular design, this tool can be utilized in in-line production or batch-wise processing. UFM is widely used in the semiconductor industry and is specifically designed for the production of small, low-cost, high-precision components. This asset is also widely deployed in the fabrication industry for grinding, lapping, and polishing of multiple large components in mass production.