Used LOH X2S #9193500 for sale

LOH X2S is an advanced wafer grinding, lapping and polishing equipment designed for high-volume production lines. It is capable of grinding and polishing a wide range of substrates, including silicon, stainless steel, ceramic and sapphire. The system features a high-precision grinding head, a feed-through polishing stage and a precision lapping stage. The grinding head is adjustable to meet the requirements of various substrate materials and thicknesses. It utilizes a computer-controlled variable speed drive motor and abrasive wheel to accurately grind substrates up to 12" in diameter. The grinding head is also able to grind two or more substrates simultaneously. This feature makes X2S ideal for a range of industrial applications, such as glass disc production. The feed-through polishing stage utilizes a CNC-controlled turntable unit, paired with either a resin or diamond polishing pad. This stage is designed to optimize throughput and produce a high-quality finish on surfaces. It is capable of polishing to dimensions as small as 0.01mm, and the turntable can be adjusted to accommodate substrates up to 6" in diameter. Finally, the precision lapping stage is designed to provide a mirror-like finish on substrates. It features a precision polishing tool with adjustable tilt and stroke speed controls, allowing for fine adjustments during grinding and polishing. The lapping disc incorporates diamond-based abrasive media to provide a superior finish on a variety of substrates. Overall, LOH X2S wafer grinding, lapping and polishing machine is a powerful and reliable solution for high-volume production lines. It provides a consistent and effective process for grinding and polishing a wide range of material types and thicknesses. It is also designed to optimize throughput and minimize errors, meaning it can produce high-quality results with minimal effort. The tool is highly customizable, allowing users to tailor the process to meet specific requirements.