Used LOH X2SL #9277308 for sale

LOH X2SL is an advanced wafer grinding, lapping and polishing equipment designed to produce high accuracy, high efficiency results. This system consists of a robotic subsystem, a diamond grinding subsystem, a lapping subsystem, a polishing subsystem and an inline inspection subsystem. The robotic subsystem uses two independent, robotically-driven stages that are designed to move large wafers through the grinding, lapping and polishing processes accurately and consistently. This eliminates the risk of human error and increases the throughput of the wafer production. The diamond grinding subsystem uses a double diamond grinding wheel to accurately grind wafers. This subsystem also includes sensors and software to monitor the grinding process and adjust parameters to ensure the edges of the wafer are ground to the desired specifications. The lapping subsystem is made up of several positionable lapping heads, designed to lap the wafer to the desired flatness. A step lapping process is used to improve the surface finish on the wafer to prepare it for polishing. The polishing subsystem consists of two polishing heads, configured to polish the wafer to a smooth surface. This is done by using a diamond abrasive slurry to smooth and polish the wafer. The slurry is controlled to give the desired surface finish, and sensors are in place to monitor the process and adjust the polishing parameters accordingly. The Inline Inspection subsystem is used to check the wafer for accuracy and defects. This consists of a vision unit with a laser interferometer and a scanning electron microscope. The vision machine is used to analyze the size, shape and crystal orientation of the wafers, while the laser interferometer is used to measure subtle features that indicate wafer quality. Lastly, the scanning electron microscope allows for highly detailed inspection of the wafer surface. Overall, X2SL tool is an advanced wafer grinding, lapping and polishing asset that produces high accuracy, high efficiency wafers with little risk of human error. Its various subsystems work together seamlessly, providing the quality results required by demanding industries.