Used MANUFACTURING TECHNOLOGY NSX-250 #9126138 for sale

MANUFACTURING TECHNOLOGY NSX-250
ID: 9126138
Wafer dicing slicing system.
MANUFACTURING TECHNOLOGY NSX-250 is an advanced wafer grinding, lapping & polishing equipment engineered to produce superior flat optical polishing results and deliver high-precision production yields. It features state-of-the-art industrial engineering that combines multiple processes for maximum flexibility, accuracy, and repeatability. NSX-250 comes standard with a spindle configuration suitable for grinding, lapping, and polishing to a surface roughness of 5 nanometers. It has a variable speed from zero to 10,000 rpm and is capable of micro-processing in a variety of sub-micron micron sizes. The hybrid design also allows for manual polishing adjustments, accuracy of +/- 0.2 microns and a standard base table travel range of 200mm. The efficient control interface simplifies operation and allows users to quickly transition between processes, making it ideal for any multi-process lapping, grinding, and polishing operation. Its adjustable speed control and high resolution feed rate offers the highest levels of accuracy, repeatability, and resolution needed to deliver cost effective and optimal results. In addition, MANUFACTURING TECHNOLOGY NSX-250 comes with a comprehensive range of accessories to ensure maximum productivity in tight production environments. It is equipped with an integrated vacuum loading system that allows for automated material handling and quick process set-up. The robust control unit features a user-friendly graphical interface and allows users to access process parameters for more versatility. The unit also features a range of safety systems, including a key lock to prevent unauthorized access. In summary, NSX-250 is an optimized wafer grinding, lapping & polishing machine developed for the demanding productivity requirements in a wide range of multi-process applications. Its precision machining capabilities and comprehensive range of features make it an ideal choice for any precision lapping, grinding, and polishing operation.
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