Used MARATHON CNC SL 500 #9012174 for sale

MARATHON CNC Equipment MARATHON CNC SL 500 is a combination of wafer grinding, lapping and polishing specifically designed for the semiconductor, MEMS and other related industries. It is a powerful CNC system with precision servo motors, highly efficient grinders and an ergonomic human machine interface (HMI) that allows for full automated operation and precise control capabilities. The unit is suitable for a large range of wafer sizes, from 4" to 300mm. The machine utilizes two high-performance submersible grinders with variable speed settings. These grinders provide uniform and consistent grinding slopes to the desired angle and thickness, ensuring accuracy and superior surface finish. The grinding is done in a high-precision spindle control tool using servo motors and precision spindles with a minimum incremental adjustment of 0.0001". The unique lapping and polishing functions of the asset offer a remarkable level of uniformity across the entire wafer surface. Polished surfaces with a low surface roughness are achievable, providing wafers with excellent optical clarity and resistance to contamination. The HMI of the model has been designed to optimize both ergonomics and operation comfort for the user. Through its intuitive touch-screen interface, user can easily and quickly select wafer sizes and process parameters and interact with the CNC equipment for operation. Also, a full-parameter data logging and reporting system verifies the process and operation integrity. In addition, MARATHON CNC Unit SL 500 is designed for easy maintenance and servicing with an accessible control cabinet design and easy access to operator interface. The machine is also equipped with comprehensive safety features that exceed industrial standards and ensure the protection of the wafers during production processes. Due to its high-precision control tool, efficient grinders and polishers and easy-to-use HMI, MARATHON CNC Asset MARATHON CNC SL 500 is a reliable and powerful device for achieving superior wafer grinding, lapping and polishing of various surface shapes and sizes. Its ergonomic design paired with reliable safety measures make it a safe and efficient production machine.