Used MARUTO ML-160A #9296308 for sale

MARUTO ML-160A is an automated wafer grinding, lapping, and polishing equipment designed to accurately and quickly process semiconductor and optical substrates. This system utilizes a combination of four diamond cutting tools, including two wafer grinding wheels, one lapping wheel, and one polishing pad. With the aid of computer numerical control, the unit enables four-axis, three-dimensional scan motion which permits modern materials processing techniques such as fast scanning and low-force gentle polishing. ML-160A is equipped with an intelligent motion control machine and a high-precision vision tool to ensure efficient production of precision wafers. The motion control is powered by integrated drives that provide independent control of the X, Y, and θ axes. This eliminates the need for separate controllers and manual settings, ensuring improved machine accuracy and reduced downtime. Additionally, the controller is integrated with a multi-axis vision asset that provides stable and quick scanning, allowing for rapid positioning of the wafer. MARUTO ML-160A boasts a mechanical performance that makes it stand out from its competitors. It is equipped with heavy-duty materials suitable for long-term use, including a stainless steel base and aluminum frame. The model also features four independent high-frequency air-bearing spindles that are capable of spinning at high speeds for precise movements. Its rotating mechanism has a synchronized design that minimizes vibration and provides a smooth operation even at high speeds. In order to improve safety and ensure accurate results, ML-160A has multiple sensors that perform real-time monitoring and precise position feedback. These sensors include force detection, rotation speed detection, and an advanced vision equipment. Additionally, the system has intelligent automatic protection features designed to ensure secure operation, such as protection against unit overload, overheat, and overcurrent. Overall, MARUTO ML-160A is a powerful and versatile wafer grinding, lapping, and polishing machine designed to produce high-quality results. With its precise motion control, advanced vision tool, and integrated sensors, it is capable of providing a reliable and accurate performance. Additionally, its heavy-duty construction and intelligent features ensure secure and efficient operation.