Used MAT BC-15C #9239638 for sale

MAT BC-15C Wafer Grinding, Lapping & Polishing System is a multipurpose grinder, lapper, and polisher designed to reduce total cost of ownership, reduce capital equipment costs, and improve product quality. This machine is equipped with a powerful, variable speed motor that enables grinding, lapping, and polishing of semiconductor materials, such as silicon, gallium arsenide, indium phosphide and quartz. Its large diameter (15") and flat surface ensure a consistent, uniform, and efficient grinding and polishing process. The machine is built with a modular design that allows users to customize their setup based on their needs. This can include a large number of grinding wheels and polishing heads. BC-15C is a powerful tool that can be used for all types of wafer processing, such as back grinding, lapping, and polishing. To accommodate a variety of wafer thicknesses and sizes, the top and bottom plates are adjustable and can be precisely positioned. The machine also features adjustable grinding plate speed adjustments and advanced diagnostic tools to help troubleshoot problems and prevent costly downtime. The modular design allows for easy cleaning and maintenance. MAT BC-15C is a reliable, efficient, and cost effective way to process wafers.