Used MAT INC / MACHINE APPLICATION TOOLS UHK-8C31M #293667041 for sale

MAT INC / MACHINE APPLICATION TOOLS UHK-8C31M is a wafer grinding, lapping, and polishing equipment offering advanced technology to production semiconductor processes. It is a computer-controlled system that is engineered for precise performance. MAT INC UHK-8C31M is composed of three internal machine components: grinding, lapping, and polishing. Each component features several adjustable parameters that can be fine-tuned for individual process optimization. The grinding component utilizes a diamond grinding wheel to abrade the surface of the wafer and remove surface imperfections. This is done in a controlled and repeatable process, and allows for thinner wafers to be produced without damaging the material. The lapping component further refines the surface of the wafer while ensuring that it meets size specifications. This step helps eliminate potential deficiencies in topography and enhances structural integrity. Finally, the polishing step provides a highly finished, smooth, and low-creep surface on the wafer. MACHINE APPLICATION TOOLS UHK-8C31M unit is fitted with several features designed to enhance safety. It features a wide-range of interlocks, such as emergency stops, air locks, and door locks, to limit access and protect personnel. The machine is also equipped with a safety-lock wheel guard to ensure the safety of anyone in the immediate vicinity. The machine's unique pressure sensing technology ensures that the exact amount of pressure is applied at all times to the wafer, ensuring high-quality results. UHK-8C31M features an intuitive user-friendly control interface that allows easy adjustment of process parameters. The tool also has an on-board camera that allows for remote monitoring of process parameters such as wheel speed and process outputs. Additionally, the asset has data collection and storage capabilities that allow for reviews of process parameters and wafer production trends. Overall, MAT INC / MACHINE APPLICATION TOOLS UHK-8C31M is an automated and reliable tool for wafer grinding, lapping, and polishing. It is designed to enhance the safety of personnel while ensuring high-quality results. The model can be used to manufacture smaller, thinner, and more uniform wafers with high precision.