Used MATSUZAWA MMT-X7A #9194204 for sale

MATSUZAWA MMT-X7A wafer grinding, lapping and polishing equipment is a fully automated, high precision wafer processing solution that is designed to optimize production yield, reduce material waste and ensure consistent quality of the end product. The system is comprised of an 8″ standard grinding, lapping and polishing table equipped with the latest technology in wafer grinding and polishing technology. At the core of MMT-X7A is an integrated high precision rotary indexing stage with built-in safety mechanisms for wafer handling. The unit is also equipped with a vacuum holding machine to ensure accurate alignment of wafers on the indexing table and an automated cleaning tool to remove surface particles during processing. For grinding and lapping, an integrated spindle motor is provided that enables fast and precise processing. MATSUZAWA MMT-X7A also offers a range of grinding wheels that have been engineered for superior material removal and virtually no chipping. The asset also features a variable speed grinding option that allows users to adjust for materials that require a lower cutting force. For polishing, MMT-X7A comes with a built-in high precision diamond grit wheel that is designed to produce a smooth finished surface. The abrasive grit size is user adjustable for a wide range of materials and applications. The model also offers a range of integrated storage cabinets that are designed to efficiently store wafers and tools. A manual tray loading equipment is available for users who prefer to manually place wafers onto the rotary table. MATSUZAWA MMT-X7A is an ideal solution for a wide range of wafer grinding, lapping and polishing applications. It's reliable, easy to use and cost effective, making it well-suited to any production environment.