Used MELCHIORRE SP3 1000 #171213 for sale
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ID: 171213
Twin spindle grinder/lapper
26" Chuck Diameter
Vertical Spindle
Power: 20 HP
26" Swing
8" Under Wheel.
MELCHIORRE SP3 1000 is a wafer grinding, lapping and polishing equipment designed to be used for precision machining of components and materials within the semiconductor and electronics industry. This system has been designed to provide a wide range of capabilities to process flat surfaces with high precision. The unit works by grinding, lapping and polishing a surface to a preset specification, which includes: surface roughness and profile, wafer thinning, wafer back-thinning, lapping and polishing at different speeds and material removal rates. Additionally, the machine is able to process wafers with different thicknesses and sizes, as well as a variety of materials such as silicon, sapphire, and glass. The tool features an HMI console which allows the operator to control a variety of parameters, including grinding speed, wet or dry operation, and the ability to set up automatic program loops for processing different types of material. The asset also has a data acquisition model which allows for the easy measurement and control of the surface roughness, profile, and material removal rates. The equipment utilizes high-precision diamond grinding wheels for the grinding and lapping process, with a precisely controlled feed force of up to 20N. The lapping process is then followed by a polishing procedure, where a constant torque motor is used to apply a uniform polishing force throughout the process. The grinding and lapping process is achieved with very high accuracy, and the system is capable of processing wafer sizes up to 300mm, with a rapid processing time of less than 5 minutes for a full wafer. The unit can also be combined with additional external systems, such as an automated loader/unloader, inspection unit, and a CMP machine, to provide additional versatility. SP3 1000 tool utilizes a range of highly advanced technologies to provide precision machining and polishing of components and materials. The combination of these technologies and its user-friendly HMI console provide reliable and repeatable results for wafer grinding and polishing, enabling the production of high-quality products and materials.
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