Used METASERV 2000 #9212907 for sale

METASERV 2000 is a wafer grinding, lapping and polishing equipment designed for the precise surface preparation of substrates, such as semiconductor wafers, SiC, Si3N4, optical glass, and semiconductor glass. The system consists of a single-axis grinding/lapping/polishing machine, a high-speed spin coater, and a laser interferometer. The grinding/lapping/polishing machine includes a precision spindle, abrasive disk cutting head, and XY linear transducers, which are used in combination to precisely position and grind, lap, and polish wafers of differing sizes and thicknesses. The spin coater can be programmed to control the wafer rotation speed, enabling a uniform coating of materials on wafers. The laser interferometer is used in Testing & Evaluation applications, such as measuring grinding force, wafer flatness, and other characteristics. The unit includes advanced motion control, which includes high-resolution, high-precision linear transducers and linear feeds in X, Y, Z and theta axes to ensure precise alignment and accuracy when machining materials. 2000 is a highly modular machine, and can easily be upgraded with additional components, such as additional spindles, additional cutting heads and XY transducers, and feed axes. It boasts a total controllable feed range of up to 20 inches, and the grind/lapping/polishing accuracy of +/- 0.00002 inches. The machine also includes a user-friendly software interface, programmed in Windows-based software, guaranteeing ease of use and reliability. In conclusion, METASERV 2000 Wafer Grinding, Lapping & Polishing Tool is a reliable and accurate asset for the precise surface preparation of e.g. semiconductor wafers, SiC, Si3N4 or optical glass. It consists of a single-axis grinding/lapping/polishing machine, a high-speed spin coater, and a laser interferometer, along with precise motion control for accuracy. It also features an easy-to-use Windows-based software interface for added convenience.