Used METCO PMV008 #9363363 for sale

METCO PMV008 is a multi-purpose wafer grinding, lapping and polishing equipment designed for demanding applications at semiconductor and other similar materials industries. This advanced system incorporates a fully automated, computerized operating unit, enabling it to perform a wide range of procedures, including planarization, rough lapping, precision-lapping, polishing, single-side and backside grinding, beveling, and polishing for small surface areas. PMV008 is equipped with an automated table feed machine and an integrated air bearing solution, providing precise, repeatable control of the grinding operation. This ensures efficient, uniform processing of fragile and sample-sized wafers. An ergonomically designed, low profile robotic arm has been incorporated to enable easy loading and unloading of the samples for optimal productivity. The tool is also equipped with a visual position feedback device, facilitating accurate and comfortable control. METCO PMV008's powerful PMV software allows for precise control over process parameters, including feed rate, table speed, rotation, grinding cycles, and pressure settings. Additionally, the asset features a powerful computer-controlled polishing head, allowing for rapid and repeatable processing operations. The wafer grinding, lapping and polishing model is designed for 12" and larger wafers, with up to 7" dimensions. PMV008 includes an in-depth process documentation suite for detailed traceability, with full historical data recording. This enables the user to monitor performance and process outcomes in a timely manner. Additionally, the equipment is equipped with integrated safety features which conform to the latest industry standards. METCO PMV008 is an efficient, powerful, and reliable wafer grinding, lapping and polishing solution, offering an unsurpassed level of capability and user flexibility for a variety of demanding semiconductor and related industries.