Used MILDEX-UDAGAWA 11A #9053028 for sale

MILDEX-UDAGAWA 11A Wafer Grinding, Lapping & Polishing Equipment is designed to quickly finish flat surfaces for semiconductor applications. It utilizes a three-phase design with a separate motor for grinding, lapping, and polishing process steps. The grinder is capable of controlling the motion of the grindstones automatically for a fine finish, and its ability to adjust the speed of each grindstone simultaneously enables it to accurately process a variety of complex surface profiles. The lapping process uses a circular motion and is adjusted according to the application's specifications. The polisher is equipped with a continuous-flow system to uniformly polish the desired surfaces. It is capable of achieving nanometer-level flatness with high uniformity and low vibration, due to its low operating noise level. 11A has a highly rigid base machined from aluminium and stainless steel for stable operation and environmental compliance. It is also equipped with a stator unit which acts as a unique mechanical support for its high precision grindstones and polishers. Its built-in high-sensitivity water seals ensure the purity of the water used for the grinding, lapping, and polishing process, and the isolator unit isolates the vibration frequency to ensure reliable operation. Additionally, its adjustable air pressure feature ensures that the grind stones and polishers evenly contact the semiconductor, providing the highest level of accuracy and precision. The unit is configured for computer-controlled operations and flexible programming with a wireless powerful remote control and a powerful SSD for data storage. It has inbuilt safety features such as an optically-isolated power that protect both components and personnel. MILDEX-UDAGAWA 11A is also fitted with an automated maintenance machine, controlling the temperature and water pressure of the tool to keep the operation within spec. Moreover, it features a comprehensive service menu which is easy to configure and monitor. 11A Wafer Grinding, Lapping & Polishing Asset is designed to meet a wide range of demands for semiconductor surface preparation. It offers maximum accuracy and precision for a variety of flat surface applications. Its rigid structure and dedicated safety features are designed to provide a safe and efficient operation while achieving the highest performance and reliability.