Used MIROKU MLS-600-4 #9120453 for sale

MIROKU MLS-600-4 is a wafer grinding, lapping and polishing equipment designed to ensure consistent, high-quality results when finishing wafers. This automated system features a variety of grinding and polishing tools, including a robotic arm for easy wafer handling, and is capable of processing both single-sided and double-sided wafers up to 6" in diameter. A 9-axis DSP controller ensures precise movements with excellent repeatability. MLS-600-4 uses two in-situ-grid wafer chucks for secure and efficient wafer handling, which are driven by both stepper motors and ball screws. Two brushless DC motors deliver a maximum speed of 200 rpm in single module. It also comes with a graphical user interface with an automatic wafer mapping unit, allowing for fast wafer loading and process setup. The grinding and polishing sequence is controlled by a MIRO-C1000 microcomputer. The MIRO-C1000 is based on a real-time algorithms for motion control and features a motor heater control machine and a range of grinding and polishing functions. The tool also supports a wide range of grinding and polishing spindles and heads, and a choice of grinding and polishing abrasives. MIROKU MLS-600-4 is designed for precision and consistency, with a low dust level and a low carbon dust level. It has a wafer cleanliness below 1ng/cm2, ensuring reliable wafer finishing results. The asset is also designed for safety, with a range of safety features including a hand-held remote, over-travel alarms and a safety switch for emergency stop. MLS-600-4 is ideal for a variety of wafer finishing processes, including grinding, lapping and polishing. It is reliable and easy to use, and its precision and repeatability ensure high-quality wafer finishing results.