Used MIROKU MLS-600-4 #9223163 for sale

MIROKU MLS-600-4 is a wafer grinding, lapping and polishing equipment that can process up to 600mm diameter wafers in a single operation. The system is comprised of four stations, known as grinding station, grinding/lapping station, polishing station, and cleaning station. The grinding station is positioned at the top of the unit and consists of a grinding wheel that rotates at speeds up to 7000 rpm. This station is responsible for grinding the wafer down to the desired thickness. Pressure is applied to the wafer using a horizontally moving arm to ensure the desired thickness is achieved. The grinding/lapping station is situated below the grinding station and consists of a rotating lapping plate on which a media wheel is mounted. The lapping plate rotates at speeds between 0 to 1200 rpm, while the media wheel moves in an up-down stroke to create a lapping action on the wafer. This lapping action helps remove any residual grinding debris from the wafer surface, leaving its surface smooth. The polishing station is located below the lapping station and consists of a counter-rotating polishing wheel and a backer wheel. The polishing wheel is used to polish the wafer to a mirror finish, while the backer wheel helps to maintain the roundness of the wafer. The polishing wheel operates at speeds between 0 and 3000 rpm and is adjustable in order to achieve the desired surface finish. Finally, the cleaning station is situated at the bottom of the machine and consists of a spin-rinse-dryer. This station is responsible for cleaning any remaining debris from the wafer surface after the polishing process and is equipped with a centrifugal extraction tool which removes any remaining particles. Overall, MLS-600-4 is an efficient and highly accurate wafer grinding, lapping and polishing asset that can process up to 600mm diameter wafers and is equipped with features such as a grinding wheel, lapping plate, polishing wheel, backer wheel, and spin-rinse-dryer to ensure a professional surface finish.