Used MITSUI SEIKI 4B #9304369 for sale

MITSUI SEIKI 4B is a powerful wafer grinding, lapping and polishing equipment designed to deliver unmatched performance in the semiconductor industry. It features a robust design and is built with the highest quality materials and components available. 4B is built with four main drive units that provide simultaneous motion and speeds up to 400 RPM. Each drive unit is fitted with an adjustable air bearing that provides smooth, quiet and precise motion. The air bearing, in combination with the drive units, allows for extremely precise and repeatable grinding, lapping and polishing operations. MITSUI SEIKI 4B is equipped with a single point precision diamond grinding wheel that is adjustable to be flush with the surface. This allows for optimal grinding and lapping results. The lapping operation is further aided by a superior vacuum system that ensures efficient and uniform lapping. The lapping chamber is made of O-ring sealed stainless steel with a full view window and an LED lamp for easy inspection of the wafers. The polishing operation is done in a semicircular lapping plate. A cover on the plate keeps the polishing process efficient and dust free. 4B also features a user-friendly graphical user interface and a built-in temperature control unit. This allows the operator to adjust the temperature of the grinding wheel and lapping plate for more efficient operation. Additionally, the machine is equipped with an efficient cleaning tool with both vacuum and pressure capabilities. The asset also comes with a high-precision loading device that ensures precise loading of wafers to keep the process uniform and efficient. MITSUI SEIKI 4B is an efficient and reliable model that is designed to deliver optimal quality results in wafer grinding, lapping and polishing operations. The equipment is also easy to use and maintain, making it a great choice for semiconductor companies and industrial facilities looking for a top-of-the-line wafer grinding, lapping and polishing system.