Used MITSUI SEIKI MFG-515H #9395048 for sale

MITSUI SEIKI MFG-515H Wafer Grinding, Lapping and Polishing equipment is a highly advanced device designed for precise grinding, lapping, and polishing of large substrates and wafers. This system is designed with a large number of features and functions that make it ideal for mass production and high volume wafer processing needs. The unit is capable of processing up to six inch wafers per operation, with a max throughput of about 115 wafers per hour. The device is built as a standalone unit with an integrated vacuum processing and an optional automatic wafer loader, and provides a number of high-performance features that make it well suited for precision wafer processing operations. MFG-515H is outfitted with specialized technologies that are designed to optimize precision grinding, lapping, and polishing processes. The machine is equipped with a radial lapping wheel and a centerless platen with independent variable motors for precise control and accurate spindle calibration. It also features an intelligent grinding pressure control machine that monitors the pressure applied to the substrate and adjusts grind pressure to ensure optimum performance. This tool also comes with an integrated software package that provides a comprehensive collection of profiles and settings for various materials such as glass, semiconductor, and ceramic substrates. This software allows users to customize the process for the specific material being processed and optimize grinding, lapping, and polishing applications. MITSUI SEIKI MFG-515H is designed with safety and compliance in mind and is outfitted with a dust collector that collects and filters fine particles for clean operations and ensures that the work space is free of hazardous dust. It also features a comprehensive safety asset that includes a 16-point safety interlock and other automated safety measures that provide added protection for employees and operators. MFG-515H has consistently received high marks from industry experts for its reliability, accuracy, and superior results and has become a popular choice for wafer processing operations. It's highly advanced features combined with its compact design and ease of operation make it an excellent choice for precision wafer grinding, lapping, and polishing applications.