Used MITSUI SEIKI MSG-200H1 #9215188 for sale

MITSUI SEIKI MSG-200H1 is an advanced wafer grinding, lapping and polishing system ideal for planarizing wafers. It features a compact design and can operate with precision in the smallest possible area, providing make-to-order processing of wafers with superior flatness. The system utilizes a unique grinding and lapping spindle which can achieve high accuracies due to its constant operating conditions. Coupled with a lapping table, it reduces grinding/lapping motions and prevents grinding marks. The grinding wheel is also driven by an abrasion-resistant motor, improving its durability and reducing downtime. The system is capable of processing wafers up to 200mm in diameter, making it suitable for a wide range of applications. MSG-200H1 also features a polishing heads which can rapidly and accurately minimize surface roughness and maximize optical reflectivity. Its polishing spindle is driven by a high-torque, low-noise brushless motor with an integrated speed controller. This enables consistent polishing, providing uniform results with excellent repeatability. The machine is controlled via an easy-to-use PC-integrated touch panel HMI, supporting various operating modes, any grinding, lapping and polishing parameters, and a variety of data logging and storage options. It also has built-in self-diagnostic functions, for added reliability and fast maintenance. MITSUI SEIKI MSG-200H1 is suitable for all industries or research requiring optimal wafer planarity in electronics, microfabrication, optical, sensor elements, solar cells, and other electronic and semiconductor components. Its flexibility, performance, ease of use and maintenance make it a great choice for precision grinding, lapping and polishing.