Used MITSUI SEIKI MSG-200HMD #9395049 for sale

MITSUI SEIKI MSG-200HMD is a wafer grinding, lapping and polishing equipment specifically designed for the production of ultra-flat and high-precision wafers, as well as the fabrication of micro-scale electronic components such as lab-on-chip devices. The system consists of 6 main processing heads, which can be configured to process 1 to 20 wafers at a time. It also has an integrated computer control unit for precision and automated operations. The grinding process is the first step in MSG-200HMD machine. It utilizes a variable speed motor to control the diamond grinding wheel, which is able to work with a variety of different wafer materials. The grinding pressure is adjustable to ensure precise and accurate results. Following the grinding process, the lapping phase is used to produce an ultra-flat surface with nano-level accuracy. The lapping process is performed by using a fine thickness film material in conjunction with a rotating aluminum or stainless steel lapping plate. The final polishing process uses a low-pressure air velocity environment to achieve extremely smooth surface finish and excellent flatness. The process is also highly cost effective and efficient, offering short operation time and excellent throughput. MITSUI SEIKI MSG-200HMD also incorporates an intelligent and intuitive user interface. This allows for the adjustment of several process parameters for precise control over the entire grinding, lapping, and polishing process. The tool also includes a monitoring asset to ensure quality is maintained throughout the entire process. Safety features are also integrated, enabling the machine to stop operation in the event of any irregularities. In conclusion, MSG-200HMD is an extremely advanced wafer grinding, lapping and polishing model. Its advanced equipment software allows for precise and automated control over the grinding, lapping and polishing process, enabling it to produce high-precision and ultra-flat wafers and micro-scale electronic components. Additionally, its integrated user interface, monitoring system and safety features ensure the highest quality output and a safe, cost-effective operation. Thus, this unit is an ideal choice for foundries and microfabrication centers looking to produce high-precision wafers and components.