Used MITSUI SEIKI MSG-200M #9093452 for sale

MITSUI SEIKI MSG-200M
ID: 9093452
Vintage: 2004
Grinding machine 2-Axis Digital 2004 vintage.
MITSUI SEIKI MSG-200M is a state-of-the-art wafer grinding, lapping and polishing equipment designed for semiconductor device manufacturing. This wafer grinding machine utilizes proprietary technologies to achieve very high levels of uniformity and accuracy on a wide variety of wafer sizes and aspects. The system has a rotary table design, allowing for efficient loading and unloading of wafers. MSG-200M comprises of an 8-axis control unit and a grinding unit. The grinding unit includes a grinding head, which utilizes an AC servo motor for precise control, and a grinding wheel. A differential wafer holder is included to ensure that wafers are held securely during grinding. The grinding head also features an oscillating design to ensure that each wafer is grinder evenly and with a consistent profile. The lapping process is also enhanced by the addition of dual lapping platters, and a lapping sample holder. The platters can be adjusted to accommodate different size wafers, and angled to ensure that the samples are held securely in place. The polishing process is executed with the use of a micro-abrasive slurry, and a watercooled polishing pad. MITSUI SEIKI MSG-200M benefits from a comprehensive unit monitor and data logging that utilizes an industrial grade touchscreen controller. This monitor provides very detailed information about the process, such as temperature, pressure, vibration, and the ability to recall data from previous runs. MSG-200M also features automatic wafer unloading. This reduces the operator's need to manually remove wafers from the machine, allowing for greater production yields. All of these features combine to create a machine that is capable of producing high quality wafer surfaces free of defects at a high rate of production. MITSUI SEIKI MSG-200M is one of the best wafer grinding, lapping and polishing systems on the market, and provides an efficient and effective way to process wafers. It has been designed for maximum precision, accuracy and repeatability, making it ideal for use in semiconductor device manufacturing.
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