Used MITSUI SEIKI MSG-200MH #170055 for sale

MITSUI SEIKI MSG-200MH is an advanced wafer grinding, lapping, and polishing equipment designed for precision flat surface fabrication of semiconductor wafers. This system features a high quality spindle assembly and dresser to ensure superior flatness and mirror-like finish on parts. Dicing blades and blades for deburring and polishing are supplied to enable exceptional surface finishes for wafers and other substrates. A full-coverage wafer grinding table is included to provide superior surface flatness and accuracy during processing, while the adjustable bridge support ensures sufficient pressure is applied over the entire grinding surface. MSG-200MH unit is equipped with an intuitive GUI interface that allows users to easily set tool paths and other parameters to best suit their application requirements. The workpiece is clamped with an air pressure-style consumable suction cup and is automatically rotated and moved along the adjustable bridge during grinding. The spindle assembly is capable of varying speeds between 1500 and 3500 rpm, allowing for an optimal polishing process. Additionally, the motor is equipped with a high-accuracy rotary encoder for precise spindle control. MITSUI SEIKI MSG-200MH also includes lapping and polishing accessories for fine surface accuracies ranging from ±50nm to ±500nm, including felt and felt composite abrasives, magnetic backup plates, and elastomer contour platens. An automatic lubrication machine is also included in the tool, which not only minimizes consumption of expensive consumables but also ensures precise and repeatable center wafer loading. A vacuum cleaning asset with advanced filter capabilities is also included to guarantee a clean, dust-free grinding surface. MSG-200MH is an advanced wafer grinding, lapping, and polishing model for precise flat surface fabrication of semiconductor wafers and other substrates. This equipment features a high-quality spindle assembly, dresser, and adjustable bridge support to ensure consistent grinding surface flatness and accuracy. The intuitive control panel allows users to easily adjust parameters to best suit their application needs. Lapping and polishing accessories are included for fine surface accuracies between ±50nm to ±500nm. With automatic lubrication systems and advanced filtration systems for dust-free grinding, MITSUI SEIKI MSG-200MH is an excellent device for precision wafer grinding, lapping, and polishing.