Used MITSUI SEIKI MSG-200MH #9211017 for sale

MITSUI SEIKI MSG-200MH is wafer grinding, lapping and polishing equipment designed for carrying out high-precision machining and fine surface finish of various substrates such as silicon, germanium, gallium-arsenide, quartz, gallium nitride and other optoelectronic materials. This system can accomplish three processes including grinding, lapping and polishing with each process producing a superior surface finish. MSG-200MH is equipped with a grinding wheel spindle with a maximum spindle speed of 10,000rpm, allowing for the highest possible accuracy and speed. The gradation of the grinding wheel is adjustable to adjust the surface roughness desired. The grinding wheel spindle is connected to a servo motor that is capable of extremely accurate speed, torque, and power control, which ensures precise control over grinding, lapping and polishing processes and ensures a uniform surface finish on the substrate. The lapping process of MITSUI SEIKI MSG-200MH is capable of lapping flat sides of various substrates such as silicon and germanium wafer. The lapping process does not require any polish or other consumable and utilizes the coarse particles of the abrasive powder to directly remove material until a desired surface roughness is achieved. This process is able to produce surface finishes with Ra in the range of 0.001 to 0.005 micron. Lastly, the polishing process of MSG-200MH utilizes a high-frequency dual-pitch wheel to precisely control the unevenness of the substrate's surface. This results in an ultra-smooth surface finish with Ra in the range of 0.001 to 0.002 micron. The processing speed can be adjusted to accommodate various substrate geometries and gradation requirements. MITSUI SEIKI MSG-200MH also includes a comprehensive set of safety features including an emergency stop unit and doors that automatically open when a process is finished. This machine is easy to use and requires minimal operator training as well as low maintenance costs. MSG-200MH is a powerful machine that provides superior results in grinding, lapping and polishing with exceptional control over cost and surface finish.