Used MITSUI SEIKI MSG-200MH #9215187 for sale

MITSUI SEIKI MSG-200MH is a wafer grinding, lapping and polishing equipment designed to provide superior results in wafer surface preparation. The system is designed to efficiently grind, lap and polish a wide variety of substrates up to 200mm with excellent surface finish quality. The unit is capable of producing very low surface roughness values down to 0.2nm average RMS. The machine is designed to work with a variety of abrasives and slurries, from diamond abrasives to polishing slurries. The tool has the speed repeatability and automated function control for repeatable wafer preparation. It has an embedded controller and graphical user interface which allows for manual or automatic operation depending on the user's preference. The asset comprises of a single-axis main rotor, and two single-axis sub-rotors. The main rotor is used for grinding and lapping processes with a variety of grit sizes, while the sub-rotors are used for polishing processes. The main rotor and sub-rotors are driven by three camshafts that provide adjustable speed and feed rates and control the machine's dynamic combinations of abrasive wheels. The machine incorporates several robust safety systems which include an emergency stop button as well as an overload model. It also has several remote control and communication options which allow for remote operation and monitoring. The equipment is extremely easy to install and operate and features a user-friendly and intuitive graphical user interface. The graphical user interface allows for customised recipes and programmable parameters that can be stored and easily accessed. MSG-200MH is a very advanced and reliable wafer grinding, lapping and polishing system that is capable of producing superior results in wafer surface preparation. The unit has excellent control over various processes and provides the user with great ease of use and flexibility. The user-friendly and intuitive graphical user interface and the remote monitoring options ensure that the machine can be operated safely and efficiently.