Used MITSUI SEIKI MSG-250H-2AH #9390529 for sale

MITSUI SEIKI MSG-250H-2AH is a multi-functional, precision wafer grinding, lapping and polishing equipment. It is designed for the grinding, lapping, and polishing of wafers with faces of up to 8 inches in diameter. It is suitable for processes in the micro and ultra-precision range and is used in the production of thin film layers, optical parts and material removal. The system is composed of a grinding/polishing platform inside a dust proof enclosure. The platform houses a rotary table with adjustable holds to hold wafers in place, while the grinding, lapping and polishing take place. The table is driven by an autostep motor with adjustment via a hand crank. For grinding, the platform contains a single wheel spindle head mounted on a two-axis XY gantry. The gantry is driven by stepper motors and offers automatic precision positioning for the grinding and polishing operations. It is also equipped with two pressure-sensitive sensors which monitor the forces applied by the wheel to the wafer and regulate the grinding and polishing pressure for optimal productivity and surface finish quality. The machine is equipped with a powerful suction unit that collects dust created during the grinding, lapping and polishing process. The filtered and exhausted air from the machine ensures a clean and safe working environment. The grinding and polishing media supplied with the tool are adapted to the various materials being processed. Depending on the material, optional grinding/polishing molds are available that allow for processing of complex shapes and geometries with high accuracy. For lapping, the asset is also equipped with a vibratory lapping table to ensure the highest quality flatness and surface finish. The table can be used for lapping both wafers and wafers with mounted pieces. A manually adjustable traverse and vibration feeder on the table enables optimized control of the lapping and polishing process. The model is designed for minimal setup time. It has flexible operation modes, allowing the operator to set specific parameters in order to save time and increase productivity. All of the parameters such as the grinding/polishing pressure, rotation speed, and lapping trajectory, feed rate can be set according to the shape and size of the wafer for maximum efficiency. Overall, MITSUI SEIKI MSG-250H-2AP is a versatile machine for precision grinding, lapping and polishing of wafers with faces up to 8 inches in diameter. With its patented technology and features, it offers unbeatable performance and excellent surface finishes for the most demanding applications.