Used MITSUI SEIKI MSG-250H1 #170022 for sale

MITSUI SEIKI MSG-250H1 is a state-of-the-art wafer grinding, lapping, and polishing equipment. This multi-functional system is suitable for edge grinding and beveling of silicon wafers, as well as for surface conditioning of quartz and sapphire substrates. The unit features a sophisticated machine design with superior reliability and accuracy. A truly versatile solution, the machine is capable of producing circular, symmetrical, and beveled edges with an accuracy of up to 0.005 mm. MSG-250H1 is equipped with a main spindle and a driven spindle, both of which are reversible. Both spindles are capable of driving diamond grinding wheels in both clockwise and counter-clockwise directions. Through the combination of clockwise and counter-clockwise grinding, MITSUI SEIKI MSG-250H1 tool performs high-precision grinding and lapping operations in one clamping operation. The main spindle is designed to have high torque, allowing the grinding of semi-hard materials such as quartz and sapphire. The driven spindle is optimized for processing thin wafers and enables fast grinding speeds. A programmable servo motor is used for linear table movement and rigidly mounts the workpiece with an accuracy of 0.00004 mm. This highly accurate and repeatable movement allows for high quality machining of different workpiece geometries. Additionally, the asset possesses a high-tech grinding head, enabling it to grind with high precision on a wide range of materials. This grinding head is also equipped with a modern and automated control mechanism, which allows for fast and efficient grinding of different materials. MSG-250H1 also contains a polishing unit, which is capable of polishing and grinding even the most intricate edges of substrates. The polishing unit can accommodate a range of aggressive polishing pads, allowing for fine polishing of most difficult substrates. With the help of an advanced vision model, the polishing unit can precisely inspect each polishing point, ensuring the highest level of accuracy. MITSUI SEIKI MSG-250H1 wafer grinding, lapping, and polishing equipment is an ideal and reliable multi-functional machine for any wafer processing application. Compact, durable, and efficient, the machine can produce high quality, ultra-precise machined parts in a wide variety of materials. With its advanced grinding head, servo motor, and vision system, MSG-250H1 unit provides consistently accurate machining of workpiece edges with an unmatched level of precision.