Used MITSUI SEIKI MSG-250H2A #9395040 for sale

MITSUI SEIKI MSG-250H2A is a highly advanced and versatile wafer grinding, lapping and polishing equipment designed to meet the most demanding needs for precision surface flatness, specifications, and productivity. This machine is equipped with a 500mm diameter grinding wheel to suit all wafer types and sizes. Movable and adjustable working tables allow for secure positioning of wafers for grinding and lapping, as well as providing a consistent, right depth of polishing. This ensures the highest quality performance and maximum surface quality with each step in the process. The robust and computerized system is fully automated, providing enhanced accuracy, repeatability, and controllability in the grinding, lapping, and polishing processes. It includes an integrated, automatic super-finishing head designed to achieve superb surfaces resulting in superior flatness and surfaces as small as 2 micrometers. This integrated unit is further coupled with a sophisticated peripheral control machine, providing operators with maximum control over the entire process. The user-friendly control employs a graphical interface that displays helpful pop-up messages, and an easy-to-use keypad for data entry and control. Also included is a series of visual displays that provide current data readings for all process parameters. For repeatable operation and long-term reliability, MSG-250H2A is designed to ensure stable operation with an air bearing integrated into the supporting stand. This provides consistent loading of the grinder/polisher throughout its full life-cycle. MITSUI SEIKI MSG-250H2A is the ideal choice for modern wafer grinding, lapping, and polishing processes, ensuring superior surface quality and high precision results. Its automated and integrated functions provide superior throughput with outstanding surface flatness even for the highest specification requirements. The user-friendly control tool and integrated air bearing make this machine ideal for process-critical applications. MSG-250H2A is the perfect machine for any precision wafer grinding, lapping, and polishing requirements.