Used MITSUI SEIKI MSG-250HMD #9268296 for sale

MITSUI SEIKI MSG-250HMD is a state-of-the-art wafer grinding, lapping and polishing equipment. This system is designed to offer process automation, high precision and repeatability for a wide range of applications and substrates. The unit uses advanced controls, process variables and safety features, making it one of the most accurate and reliable solutions for grinding, lapping and polishing products in the semiconductor industry. MSG-250HMD machine features a high-performance spindle motor for exacting results and minimum vibration, providing maximum accuracy and precision in various grinding, lapping and polishing processes. The motor is capable of producing speeds in the range of 30,000 to 180,000 rpm, enabling a wide range of processes with different feed rates. The tool is also equipped with an integrated air-bearing spindle to provide articulation for your specific application needs. MITSUI SEIKI MSG-250HMD asset also offers precise pressure control. This is important for evenly distributing the pressure around the wafer while grinding, preventing damage to the substrate caused by excessive pressure, and leading to longer grinding wheel life. The model also offers variable feed rates ranging from 0.0625 to 0.3 m/min, allowing for precise control when polishing the substrate. The equipment allows for automated processes and is integrated with MITSUI SEIKI grindSense toolkit. This toolkit allows users to customize processes for different substrates with various parameters such as grain size, feed rate, pressure, and grinding wheel speed. This ensures higher productivity and lower risk of errors. MSG-250HMD also benefits from the Seiki-Tech system intelligence. This intelligence allows for ground-level fault diagnoses and error prevention. This is a key feature for producing consistent results and maintaining the highest quality of parts. The unit is also supported by MITSUI SEIKI preventative maintenance technology using Scheduled Maintenance & Diagnosis Machine (SMD) for best tool performance. MITSUI SEIKI MSG-250HMD provides excellent performance and accuracy for grinding, lapping and polishing processes. With its advanced features, it is able to deliver precision results as required by the semiconductor industry. Additionally, it features asset intelligence and automated processes, providing a reliable solution for achieving excellent quality parts. With its excellent features and reliability, MSG-250HMD is an excellent choice for anyone looking for a reliable and efficient wafer grinding, lapping and polishing model.