Used MITSUI SEIKI MSG-250SE #9211018 for sale

MITSUI SEIKI MSG-250SE equipment is a state-of-the-art wafer grinding, lapping, and polishing system that caters to the requirements of the semiconductor and electronic device manufacturers for cutting-edge technology in the wafer fabrication process The unit is equipped with a powerful motor drive and a proprietary advanced pressure control machine that automates the grinding and polishing processes. It is designed to work with both semiconductor and compound materials and features a high-levels of accuracy, providing a fine-grained and uniform surface texture for a variety of applications. MSG-250SE combines a robust grinding head tool with a powerful lapping plate to offer versatile and reliable grinding operations. The asset utilizes an advanced wheel drive technology that ensures a uniform and stable grinding performance for either substrate materials or combinedmultiple materials. Additionally, its micro force-controlled technology can be adjusted to vary different levels of grinding forces to enable precise grinding and polishing processes. Furthermore, the model is also integrated with a high-precision contact force sensor that, combined with the advanced pressure control equipment for regulating the grinding forces, provides highly accurate and uniform grinding processes with little to no material loss. Additionally, the contact force sensors are used to detect any potential deviation in grinding performance and subsequently adjust the system as needed. On the polishing side, MITSUI SEIKI MSG-250SE employs an inverse polishing unit technology that utilizes two sets of mirrored fine polishing plates to simulate a real-life polishing situation and facilitate a consistent polishing or burnishing operation. It also features a microslip effect that helps reduce surface roughness while preserving the integrity of the surface. Overall, MSG-250SE is an advanced and versatile wafer grinding, lapping and polishing machine that enables efficient and accurate grinding and polishing processes for a variety of semiconductor and compound materials.