Used MITSUNAGA 9B-5L #9007413 for sale

MITSUNAGA 9B-5L is a wafer grinding, lapping and polishing equipment designed to accurately shape and finish a variety of wafer and workpiece materials. This system is designed to achieve high precision and accuracy for flat wafers by combining grinding and polishing technologies. The unit is built with Mitsubaga's high-precision grinding technology for the processing of high-precision and ultra-flat wafers. The machine features a rotating spindle head, capable of grinding and polishing at the same time for maximum performance. The spindle head is designed to run at very high speeds and is also capable of running in-process adjustments for fine-tuning the lapping and polishing process. A variety of grinding attachments and plates are available to support different wafer or workpiece materials, enabling the tool to process a wide range of materials. The grinding process is then followed by a wet-polishing process, and the resulting surface is cleaned apolarity, and further polished to a highly accurate and defect-free surface finish. The asset also supports an optional full-face planarization capability to create flat and planar surfaces on tapered wafers, and can also be used to rough polish larger objects with a flat top surface. The model is built on a rigid steel base and comes with vibration dampening feet, which ensures the equipment operates accurately and with minimum vibration. The programmable controller allows for easy and accurate operation of all configured processing functions. It also comes with a data logging system capable of recording the status of all unit parameters, allowing for analysis and optimization of the grinding and polishing process. Overall, 9B-5L is a highly accurate and precise wafer grinding and polishing machine. This tool can effectively grind and polish a variety of wafer and workpiece materials, creating planar surfaces with minimal defects. It is an excellent tool for high precision wafer processing applications.