Used MITSUNAGA MFL-3B #9086147 for sale

MITSUNAGA Manufacturing Factory Line (MFL) 3B is a wafer grinding, lapping & polishing equipment, constructed to achieve maximum efficiency, quality and precision in the production process of wafers used in the semiconductor industry. The system employs technology that is both reliable and economical, providing an excellent polishing and grinding performance. MITSUNAGA MFL-3B is designed to process wafers up to 8" in diameter and set up to process shapes like round, rectangles, and octagons. Featuring both an Elastic Transformer Type (ETT) and a Magnetic Transformer Type (MTT), MFL-3B unit provides efficient grinding processes combined with highly effective non-contact lapping and polishing for superior performance results. The machine is versatile and easy to use, featuring fully automated process control to simplify the production process with high consistency in quality. MITSUNAGA MFL-3B has integrated magneto-rheological (MR) fluid technology to maximize grinding performance, providing a more uniform surface finish across the wafer and crystal particles removal with minimal damage. The tool is also equipped with MR fluid temperature control, offering more transposition cutting by avoiding agglomeration and blocking from coolant oil. MFL-3B's capabilities include precision grinding andpolishingfor 1um size grains, as well as controlling the number and size of diamond segment (DS) grains used per wafer size. In addition, the automatic height adjustment of the wafer to the diamond wheel surface allows for precise and repeatable processing of the wafers. Moreover, the platen-type mounting structure is able to handle up to 12 wafers at one time with reduced manual handling. MITSUNAGA MFL-3B's design also delivers protective features including air controlled down force and a dedicated spindle to Automatically compress the wafer without wobbling or deformation. This asset is further capable of automatically rinsing and cleaning the wafer surface with a built-in water sprayer. It also has a dedicted chip removal model, which is able to accurately discharge the chip and cleanly deposit it on the waterproof cleaning box to minimize disruption to the production processes. In conclusion, MITSUNAGA Manufacturing Factory Line (MFL) 3B is an effective wafer grinding, lapping & polishing equipment, designed to enhance the production processes of wafer fabrication used in the semiconductor industry. This system is equipped with modern technologies to provide a superior grinding and polishing unit, as well as offering a variety of protective features to ensure efficient and precise production runs.