Used MITSUNAGA MFL-3B #9152612 for sale

MITSUNAGA MFL-3B wafer grinding, lapping, and polishing equipment has been designed to provide precise, highly repeatable processes and results for prepped optical and semiconductor wafers that require high levels of quality control and repeatability. The system offers integrated software controls to easily monitor and control the processes for wafer cleaning, grinding, lapping, and polishing. The three-axis, fully automated unit includes a high-precision rail and linear motors for each axis which allow the machine to deliver precise, precise movement. Additionally, it has a precision grinding head, polisher spindle, and a high-performance lapping plate. MFL-3B wafer grinding, lapping, and polishing tool can be used for applications such as flat substrate grinding and polishing, wafer edge sharpening, and lapping for semiconductor and optical wafer applications. Additionally, each of the three axes has an ability to be programmed for variable speed, allowing the operators to adjust the processing speed for the surface accuracy requirements of any given application. This asset features a touchpanel user interface, allowing for easy monitoring and control of the processes. The model uses grinding wheels and polishing cloths to achieve the desired surface finishes and shape tolerances. The grinding wheels are typically mounted on the precision grinding head, which is driven by the linear motor. A belt-driven spindle housing the polishing cloths is provided for accurate polishing of the substrates. The lapping plate consists of an adjustable plate and the lapping material. The adjustable plate allows for different angles of attack and thus accurately controls the polishing or lapping process. MITSUNAGA MFL-3B wafer grinding, lapping, and polishing equipment is designed to be a highly efficient and reliable system for prepping optical and semiconductor wafers. The unit combines precision controls, user-friendly interface, and high-performance components to provide accurate, repeatable processes. The machine also has the ability to handle large volumes of substrates quickly, making it an ideal choice for manufacturers needing to reduce process time.