Used MITSUNAGA MFL-3B #9312849 for sale

MITSUNAGA MFL-3B Wafer Grinding, Lapping & Polishing equipment is a fully automated, high-precision system designed for grinding, lapping and polishing semiconductor wafers. It is ideal for the production of highly accurate, uniform surfaces on wafers with a variety of lithographic structures, such as 3D structures, ultra-fine line widths, and planarizing of uneven surface shapes. The unit includes an industrial strength spindle motor with a variable speed of up to 300,000 rpm. This allows for precise grinding, lapping, and polishing of semiconductor substrates. The machine also includes a pre-cooler, to help reduce thermal loading of the wafers during production, as well as a flexible tool changer to allow for flexible tooling options. The grinding wheel and lapping plate are equipped with automated defect detection systems to ensure precise, uniform surfaces are achieved. The vibration isolation table ensures optimal grinding conditions and eliminates unnecessary vibration to ensure quality wafer surfaces. In order to enhance surface flatness and reduce the incidence of burr formation, MFL-3B is equipped with a velocity profile control tool. This asset senses the shift in the surface velocity of the wafer, and regulates the speed of the grinding head to optimize grinding performance while reducing wafer wear. To ensure highly uniform surfaces, the model is also equipped with a tracking equipment that automatically keeps track of the orientation of the wafer in relation to the grinding wheel or lapping plate. This ensures that the same surface element is ground repeatedly, and that the orientation of the wafer is maintained throughout the process. The system is capable of automatically controlling the entire process and is designed to be used with minimal human supervision. It features advanced data acquisition and reporting capabilities, and is designed to be integrated into an existing computer network for complete automation of the production process. MITSUNAGA MFL-3B is a robust, precise, versatile, and efficient wafer grinding, lapping, and polishing unit that can be used to produce high-quality surfaces on a variety of semiconductor wafers.