Used MITSUNAGA MFL-3B #9329133 for sale

MITSUNAGA MFL-3B is an all-in-one wafer grinding, lapping, and polishing equipment that provides users with a comprehensive, automated, and user-friendly solution to the task of polishing wafers. The system is equipped with a robust and powerful servo motor that enables fast, efficient, and precise grinding and lapping operations. Additionally, MFL-3B utilizes an integrated computerized numerical control (CNC) unit and advanced tooling technologies to ensure complete accuracy in polishing operations. MITSUNAGA MFL-3B is composed of multiple units that are interconnected with a sophisticated motion controller. The motion controller ensures smooth and accurate operation of the entire machine as well as the individual components. The tool also features an array of safety features, including a safety lock switch and overload warning systems. In order to efficiently grind and lap wafers, MFL-3B is equipped with a three-spindle grinding disc that increases the rate of the grinding process. The asset also features a rotary table with grinding patterns that can be easily adjusted for different degrees of finish. The streamlined design of the model allows for easy removal and replacement of grinding discs when necessary. The polishing unit of MITSUNAGA MFL-3B uses optical profilers to accurately detect surface errors and initiate corrective polishing operations. The equipment utilizes pneumatic-controlled abrasives and adjustable polishing speeds to ensure uniform and precise polishing performance. The abrasives are fed into the system via adjustable valves, and the speeds of the abrasives and valves can be easily adjusted to accommodate different polishing requirements. In addition to the precise grinding and lapping operations, MFL-3B offers dust and noise control systems. The dust control unit can be adjusted for different levels of dust collection. The noise control machine features a user-friendly noise control panel and a built-in noise reduction tool. MITSUNAGA MFL-3B is the ideal wafer grinding, lapping, and polishing asset for a range of applications. It is well-equipped to provide high performance and reliable operation even in challenging industrial environments. The integrated CNC and tooling technologies, precise polishing operations, efficient grinding and lapping, dust and noise control systems, and user-friendly design make it an ideal choice for any polishing application.