Used MITSUNAGA MFL-3B7S #293668246 for sale

MITSUNAGA MFL-3B7S is an ultra-precision machine designed for grinding, lapping and polishing of various substrates used in the microelectronic industry. The machine features a 10"x13" flat platen, a 0.001" flatness and a material removal rate of 0.000075". The machine is equipped with a 24-tool wet-chemical tool table, as well as a multi-function, servo-driven coordinate equipment. In addition, the machine includes a 4-axis servo-driven stage and a three-dimensional diamond stylus for precise positioning. The machine's platen is constructed of air-cooled, dura-plated, highly rigid carbon steel plate designed to handle a wide variety of substrates. The platens are covered with 35-mil diamond-treated polishing surfaces and the complete package includes a diamond-treated coating and a diamond abrasive wheel for polishing. MFL-3B7S has a water-fed, cantilever spindle for flat-tip grinding and lapping and a 4-axis spindle drive for localized grinding and lapping of substrates. The machine also features a high-accuracy, high-load capacity, Swiss-made linear bearing system for precise control of loads. The spindle is equipped with DC brushless motors that provide a high-precision operation and low vibration during operation. The machine's control console is highly intuitive and includes a touch-screen user interface for easy programming and operation. The console provides information about the material removal rates and grinding parameters, as well as a convenient visualization window that allows operators to quickly identify the grinding area of the substrate. MITSUNAGA MFL-3B7S utilizes a vacuum unit to keep the grinding/lapping area clear of dust and debris. The vacuum machine is designed to collect any debris that may be generated during grinding/lapping and is easily emptied during operation. MFL-3B7S is ideal for an array of precision grinding/lapping and polishing needs and provides excellent quality and reliability. The machine is well-suited for a variety of tasks in the microelectronics industry, including grinding/lapping of substrates, polishing of thin-film components, as well as long-term reliability testing of microelectronic components.