Used MITSUNAGA MFL-4B-5S #9050571 for sale

MITSUNAGA MFL-4B-5S is a wafer grinding, lapping & polishing equipment. It is used to grind, lap, and polish semiconductor substrates and other microelectronic components to a superior surface finish. The system is designed with high precision features such as an NC-controlled feedrate unit for accurate plane grinding of multiple wafers. Additionally, a programmable grinding head rotation control machine enables optimal grinding results and high productivity. The tool is ideal for both single wafer processing and mass production. MFL-4B-5S is composed of a robot arm that handles up to four wafers at once and a working table at the center. The robot arm features a special form that is compact and lightweight, enabling it to move almost freely between the ears in the X-axis and the axis of the grinding wheel in the Y-axis. This flexibility allows the robot arm to accommodate a variety of applications such as plane grinding, stock removal, and edge profiling that require smaller fiducial positions. The working table is composed of three parts, the main spindle, the side spindle, and the robot arm. The main spindle is a variable frequency motor with a maximum speed of 8,000 RPM for the grinding and lapping processes. The side spindle is equipped with a unique air spindle motor with variable speed that can reach up to 15,000 to 40,000 RPM for fine polishing operations. Both motors are controlled with an NC-driven asset for precision and accuracy. The model also features a variety of process control functions. The grinding mode, grinding speed, pitch angle, and wide regulation range of the feed rates can all be controlled for efficiency and superior finish. The equipment also features three simultaneous auto-corrections that are done independently by the robot arm and the main and side spindles. This ensures that all of the wafers can be grinded and lapped to the same dimensions without any minor discrepancies. Additionally, the pressure exerted onto the grinding and lapping wheels can be adjusted to match the wafer type and size for a more precise and complete finish. In conclusion, MITSUNAGA MFL-4B-5S is a high-precision wafer grinding, lapping & polishing system that is specifically designed for semiconductor substrates and other microelectronic components. Its unique features and advanced process control functions make it an ideal choice for producing high quality and consistent surface finishes.